LA/OC SMTA is Proud to Present an Educational and Networking Event...

2016 Corporate Member Appreciation Breakfast

Improving the PCB Assembly Manufacturing Processes by Utilizing an Alternative Solder Paste: A Statistical Evaluation

Doug Dixon

Global Marketing Director
Henkel Electronic Materials, Inc.

To address the requirements of component miniaturization, high-density board designs and ever-increasing throughput and yield, solder paste technology is evolving. Not only must next-generation solder materials offer meaningful improvements in process performance, but also provide more manufacturing flexibility by expanding the process window. The ability to effectively accommodate manufacturing environments where assembly processes are interrupted, where the luxury of long start-up times are non-existent and where materials are often handled non-optimally, materials capabilities in the modern age of manufacturing are critical.

Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented. As basis for the analysis, solder materials were exposed to harsh environments to understand if the new solder paste technology is capable of withstanding the realities of modern manufacturing processes for fine pitch components (0.3 mm CSPs and 01005/0201 passives). Evaluation of solder paste printing performance was a primary focus of the investigation, taking into consideration numerous common board finishes and stencil aperture designs. Paste volume measurements acquired by SPI were used to verify solder paste volume on pads to quantify performance. Challenging manufacturing processes were simulated by aging the pastes at room versus elevated temperatures and then printing at defined time intervals. Simulated extended continuous printing was also examined. A detailed statistical analysis identifies the relationship between the condition of the solder paste and the paste volume on the pad of a given component type.

Douglass Dixon is the Global Marketing Director for Henkel Adhesive Technologies, Electronics group. Dixon is responsible for managing Henkel’s marketing intelligence, commercial product launch, and marketing communications for the electronics business unit. With over 28 years of electronics industry experience, Dixon has a broad skill set that includes engineering, field service, applications, product management and marketing communications expertise. Since joining Henkel in 2001, Dixon’s role has centered on strategic communications initiatives that have significantly raised the company’s profile within the global electronics market. During his tenure at Henkel, Dixon has also championed multiple service initiatives on behalf of the company that have made a positive impact on the communities in which Henkel Electronic Materials employees live and work. Examples include Henkel’s work with Think Together, a California-based organization dedicated to encouraging children to stay in school; and the Tianhua Orphan Education Project, a Chinese charity that provides full educational assistance for orphaned children.

Dixon holds an Engineering degree from the University of Utah and, in his current role with Henkel, is based in the company’s Irvine, California facility.

Thursday, June 16th, 2016
(3rd Thursday of the Month)

10am, Meet & Greet
10:20am, Breakfast
11:00am, Presentation
11:30am, Chapter Announcements

Cash or Check
$0, 1st Corporate Member
$10, Each Add’l Corp Member
$10, Member
$20, Non-Members

Paypal Payment
(Fee + 2.9% + .30 Processing Fee)

$10.60, Add’l Corp Member & Members
$20.90, Nonmembers

Catered by Sandor's Gourmet Catering, Inc.

Scrambled Eggs
Served with Bacon & Sausage,
Home Fried Potatoes & Salsa on the Side
Assorted Breakfast Breads, Sliced Fruit
Assorted Juices, Reg. Coffee & Decaf

Paradigm Contract Manufacturing LLC
11562 Knott Street, Unit 13-14
Garden Grove, CA, 92841-1823
PH - 714-889-7074
FAX - 714-893-1801