|LA/OC SMTA is Proud
to Present an
Educational and Networking Event...
Chapter Dinner Meeting
Member Appreciation Night
IC Packaging Trends
Specifications on Assembly Reliability
Reza Ghaffarian, Ph.D.
Jet Propulsion Laboratory
For five decades, the semiconductor industry
has distinguished itself from other industries by continuously shrinking
ICs. This has enabled functional improvement (Moore's Law) and allowed
IC shrinkage for a much lower cost. The problem now is that IC shrinkage
hit a brick wall. In response, a new paradigm shift is emerging: we're
no longer shrinking the IC, instead industry is focusing on shrinking
the packaging through stacking and system integration. This talk presents
IC packaging shrinkages/trends from ball grid arrays to stack packaging
technologies. As the chair of IPC 6-10 d task, the presenter has been
involved in generating numerous specifications on assembly reliability
of advanced electronic packaging using tin-lead/lead-free solder alloy.
These specifications and the key requirements will also be reviewed.
Dr. Reza Ghaffarian has more than 30 years
of industrial and academic experience. For the last 20 years at NASA/JPL,
he led R&D reliability and quality assurance activities in advanced
electronic packaging and has been a consultant resource for most JPL projects
including Mars Curiosity Rover. He has received many awards including
the NASA Exception Service Medal for outstanding leadership and industrial
partnership. He has authored more than 150 technical papers, 7 book chapters,
two guidelines, and co-edited a CSP book. He serves as technical Advisor/Committee
to IPC, Microelectronics Journal, SMTA, IMAPS and IEEE IEMT/CPMT. He received
his Ph.D. in 1982 from University of California at Los Angeles (UCLA).
Thursday, May 21st, 2015
(3rd Thursday of the Month)
6:00PM, Social Hour
(Fee + 2.9% + .30 Processing Fee)
Does not Include Beverages
JT Schmid's Restaurant & Brewery
2610 E. Katella Avenue
Anaheim, California 92806