LA/OC SMTA is Proud to Present 2015
5th Annual Expo & Tech Forum

Free Lunch!
Free Technical Sessions!
Free Parking!
Free Raffle!

4 $25 gift cards will be Raffled every hour
+ 2:30pm Exhibit Floor Raffle

Thursday, November 5th, 2015
(1st Thursday of the Month)

The Grand
4101 E. Willow St.,
Long Beach, CA 90815
T. 562.685.8198

Driving Directions

Event Flyer
2015 Event Flyer

Event Brochure

Show Hours
10am to 3pm

View 2015 Tech Expo Vendors

Technical Session 1
11am to 11:30am
Electrical Reliability as a Function of Reflow Profile

Mitch Holtzer

Speaker Bio
Mitch Holtzer is the Global Director of Customer Technical Support for Alpha Metals based in South Plainfield New Jersey. He has been with Alpha since 1998. Prior to the CTS position he had been Global Product Manager for Preforms, Global Product Manager for Wave Soldering Flux and GPM for Solder Paste. After becoming Director of Product Management he was promoted to Global R&D Director.
Mitch has a B.S. in Chemistry from Purdue University and a MBA in Finance from Temple University. He has published over 20 articles and has spoken at IPC Apex, SMTAI International and SMTA Philadelphia numerous times.

Presentation Abstract
Electrical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrical reliability of a printed circuit. This paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues.
Three different reflow temperature vs. time profiles, a 1.5 °C/s ramp to 230°C, a 1.5 °C/s ramp to 250°C and a 90 s soak at 175°C with a 230°C peak, were used to reflow three lead-free solder pastes in both air and nitrogen atmospheres. Fourier transform infrared spectra of the reflowed flux residues shows how reflow profile conditions and atmosphere affects the decrease of a peak around 1700 cm-1 and the appearance and increase of another peak at 1600 cm-1. The 1700 cm-1 is smaller for flux residues that were reflowed under hotter conditions and for those that were reflowed in air. The peak at 1600 cm-1 is larger for residues exposed to hotter reflow profiles in air, but is hardly present for residues reflowed in nitrogen. The affect of these reflow conditions on surface insulation resistance (SIR) per IPC-TM-650 Method at 40°C 90% RH and 12V bias has been studied. This measurement shows that hotter reflow conditions result in higher SIR values for two of the pastes, as would be expected, but has a smaller affect on the third paste.

Free for All

11:45am to 12:45pm

Technical Session 2
1:00pm to 1:30pm
Oh, Flux! – How Not to Clean Electronics Assemblies

Barbara Kanegsberg & Ed Kanegsberg
BFK Solutions LLC

Speaker Bio
Barbara Kanegsberg, President of Los Angelesbased, BFK Solutions, is a recognized expert and consultant in critical and industrial cleaning, electronics assembly, and contamination control. “The Cleaning Lady” effectively helps companies optimize manufacturing cleaning processes, improve yield, resolve regulatory issues, and maintain trouble-free production. Projects include electronics assembly, medical devices, engineered coatings, metals, pump repair, and optics. On the grounds that cleaning should be fun, she conducts dynamic, engaging interactive workshops. She is an active participant in the IPC 5-31D Cleaning Handbook Task Group as well as in JS3, an interagency military group and in the ASTM medical device Cleanliness Testing Task Force. Barbara is the editor-in-chief of the "Handbook For Critical Cleaning,” 2001, CRC Press, with an expanded second edition in the works. Barbara received the 1996 U.S. EPA Stratospheric Ozone Protection Award in recognition of her work in productionizing practical defluxing processes. She co-authors columns for Controlled Environments Magazine and Process Cleaning Magazine. Her practical experience encompasses clinical chemistry and aerospace. Barbara has a B.S. in Biology from Bryn Mawr College and an M.S. in Biochemistry from Rutgers University.

Presentation Abstract

Is it the irate customer? Is it the flux residue? Is it the friendly SCAQMD or OSHA inspector? You’ll laugh; you’ll cringe! You’ll have fun! Forget the success stories. We all tend to hear glowing reports of successes. Research has shown that successes are reported; failures are not. You can learn more from failures than successes. Hear about real-life cleaning mishaps. Hear about “partial successes.” Learn how to interpret success stories and adapt the approach for your own manufacturing facility. Come away with great ideas to clean electronics assemblies and to avoid costly investments in process equipment and chemicals that are not right for you. Understand how to fix small issues before the line goes down, before you lose business. Unlike reality T.V, most names will be changed to protect the innocent.

Technical Session 3
2pm to 2:30pm
Effects of Shelf Life and Manufacturing Environment on Solder Paste


Neil Poole


Speaker Bio
Dr.Neil Poole is a Senior Applications Chemist in Henkel Technologies, electronics assembly materials application engineering group. He is responsible for all of Henkel's assembly products including soldering products , underfills, PCB protection materials, and thermally conductive adhesives. He holds a Ph.D. Catalysis and a B.Sc in Chemistry from the University of Edinburgh in Scotland.

Presentation Abstract
A number of studies have shown that up to 60-80% of all electronics assembly defects are related to the solder paste printing and reflow characteristics. Since the introduction of lead free solder paste, manufactures have concentrated on improving the printing performance and widening the reflow window, but the number one problem in assembly of circuit boards still point to the solder paste. While some of these defects can be blamed on environmental elements, temperature, and humidity on the factory floor or possible temperature variations during the shipping and handling. The condition of the paste, while fresh is usually good, but many of the process defects may be attributed to the logistics of getting material from the vendors to the shop floor. In this presentation Henkel will explore effects of shelf life and manufacturing environment on solder paste.

Exhibit Floor Raffle
Special Thanks to our Raffle Sponsors

Exhibitor COST
Corporate Members = $350/$450 (early/late)
Click here for Membership Information
Non-Corporate Member = $425/$525 (early/late)

Exhibit package includes:
one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

Floor Layout Diagram
2015 Floor Plan

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Please Note: To be Listed on our TECH EXPO Page as a Vendor for the Show You Must Formally Register & Pay
Through SMTA National Website At: