NOVEMBER 2016 EVENT

LA/OC SMTA is Proud to Present 2016
6th Annual Expo & Tech Forum


ATTENDEE COST
FREE FREE FREE
Free Lunch!
Free Technical Sessions!
Free Parking!
Free Raffle!

4 $25 gift cards will be Raffled every hour
+ 2:30pm Exhibit Floor Raffle


DATE
Thursday, November 3rd, 2016
(1st Thursday of the Month)

LOCATION
The Grand
4101 E. Willow St.,
Long Beach, CA 90815
T. 562.685.8198
http://thegrandlb.com/

Driving Directions


Event Flyer

Agenda
Show Hours
10am to 3pm

View 2016 Tech Expo Vendors

View Past Tech Expo Vendors


Technical Session 1
11am to 11:30am
~Ask The Experts~

Meeting the Challenges of Effective Cleaning/Defluxing
in Southern California

Chairperson
Barbara Kanegsberg
BFK Solutions

Panel
Julie Field
Technical Devices Company

Naveen Ravindran
Zestron

Gilbert Roberge
Inventec Performance Chemicals

Paul Petruna
Sirco Industrial Inc.


Lunch
Free for All

11:45am to 12:45pm


Technical Session 2
1:00pm to 1:30pm
Teardowns of IoT and Wearables Devices

Speaker
Dr. Bill Cardoso

CEO
Creative Electron, Inc.


Speaker Bio
Bill started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who designs and manufactures x-ray systems that are shipped worldwide. Starting with an associates degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill is the president of the SMTA San Diego chapter and member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 120 technical publications, a contributor to 2 books, owner of a few patents, and a frequent speaker at technical conferences.

Presentation Abstract

The impulse to break a new gadget to "see what's inside" is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this talk we will cover the teardown of several IoT and wearable devices, from the early Blackberries to the Apple Watch, to understand how the SMT industry has changed. These findings will also help us forecast where we are going as a community by discussing miniaturization and packaging, automation and labor force location, device features, and other important topics. These are key issues we need to address to keep U.S. SMT manufacturing relevant.


Technical Session 3
2pm to 2:30pm
Avoiding Assembly Pitfalls at the Bare Board Design Stage
A discussion of factors that drive PCB and assembly costs which should be considered early in the design phase to save your company $$$.

Speaker
Julie Ellis
Field Applications Engineer
TTM Technologies, Inc.

Speaker Bio
Julie Ellis is a Field Applications Engineer, or as her LinkedIn profile simply states, “PCB Problem Solver.” She boasts creds that include a BSEE and an IPC Master Trainer certificate, not to mention being a survivor of the Viasystems/TTM merger and the other ups and downs our industry has experienced since she began her career as a student-engineer at Hughes Aircraft in 1982.

Presentation Abstract
A designer is faced with many challenges when planning their layout to achieve a balance of performance, quality and reliability versus cost. In this presentation, Julie will discuss common PCB-related assembly factors that contribute to cost and explore the trade-off considerations for design optimization. She will explore panel utilization, IPC Classes 2 and 3, design geometries and spacing, via protection, solder mask-defined pads and dams, and surface finishes. By thinking “Outside the Board,” assemblers can avoid pitfalls of unintended design consequences.


Exhibit Floor Raffle
2:30pm
Special Thanks to our Raffle Sponsors


Exhibitor COST
Corporate Members = $375/$475 (early/late)
Click here for Membership Information
Non-Corporate Member = $450/$550 (early/late)


Exhibit package includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.

Floor Layout Diagram
2016 Table Locations