|OCTOBER 2015 EVENT|
is Proud to Present an Educational and Networking Event...
2015 Chapter Tutorial Program
Zen and the Science of Electronic Assembly
Best Practices in SMT Assembly
You have the responsibility and resources to improve the productivity of an assembly operation .what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.
o Optimization Objective
o Getting the most productivity from an existing line
o Definition of "Best Practices"
o Best Practices in the Assembly Process
o Solder Paste Printing process best practices
oPick and Place best practices
oReflow soldering best practices
o Wave and Selective soldering best practices
o Cleaning vs No-Clean considerations and best practices
o Best Practices concerning "challenging technologies"
o Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs
o Q & A
WHO SHOULD ATTEND
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose,CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr.Zarrow was responsible for specifying and setting up medium and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of "SMT Glossary - Terms and Definitions", an industry reference book. Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders Award(2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and is the author of the award winning "On the Forefront" and "Better Manufacturing" columns.
Thursday, October 15th, 2015
(3rd Thursday of the Month)
9:00am to 4:30pm Presentation